Opto-electronic packaging of 2-D surface active devices

Autor:	M.F. Brady, N.R. Basavanhally, D.B. Buchholz
Rok vydání:	2002
Předmět:	Surface (mathematics) Interconnection Materials science Optical alignment business.industry Process (computing) Optoelectronics Opto electronic business Chip Active devices
Zdroj:	Proceedings of LEOS'94.
DOI:	10.1109/leos.1994.586969
Popis:	Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::968a4e90c7f1aa314de75f744cfa84e8 https://doi.org/10.1109/leos.1994.586969 Zobrazit plný text záznamu