Titanium and tantalum coatings on aluminum nitride

Autor:	W. B. Carter, M. V. Papageorge
Rok vydání:	1992
Předmět:	Auger electron spectroscopy Scanning electron microscope Tantalum Analytical chemistry chemistry.chemical_element Surfaces and Interfaces Nitride Condensed Matter Physics Evaporation (deposition) Surfaces Coatings and Films chemistry X-ray photoelectron spectroscopy Thin film Titanium
Zdroj:	Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 10:3460-3464
ISSN:	1520-8559 0734-2101
DOI:	10.1116/1.577803
Popis:	Thin films of titanium and tantalum were deposited on aluminum nitride substrates by vacuum evaporation at T=573 K. Pull tests of film/substrate interfacial strengths yielded 57.57±14.41 and 67.71±9.31 MPa for Ti/AlN and Ta/AlN, respectively. The coatings have been examined by profilometry, scanning electron microscopy, x‐ray diffraction, Auger electron spectroscopy (AES) and x‐ray photoelectron spectroscopy (XPS). Depth profiles were performed with both AES and XPS. The data indicate that nitrogen, from either the substrates or their surfaces, diffuses into the titanium films and combines with them chemically. No clear evidence for a similar reaction between tantalum films and the AlN substrates was found.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::961a31bba73c92393d9495c5864de225 https://doi.org/10.1116/1.577803 Zobrazit plný text záznamu