Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions
| Autor: | Yin Fa Chen, Yang Hsien Lee, Fok Foo Lee, Choo Yeow Lee, Hwa-Teng Lee |
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| Rok vydání: | 2009 |
| Předmět: |
Microstructural evolution
Materials science Morphology (linguistics) Silver sulfide Metallurgy Intermetallic chemistry.chemical_element Condensed Matter Physics Microstructure Electronic Optical and Magnetic Materials Crystallography chemistry.chemical_compound chemistry Antimony Soldering Materials Chemistry Electrical and Electronic Engineering Indium |
| Zdroj: | Journal of Electronic Materials. 38:2112-2121 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-009-0884-2 |
| Popis: | The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints␣were examined. The results showed that In prompts the formation of Ag3(Sn,In), Ag2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag3Sn to Ag3(Sn,In) and finally to Ag2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu6Sn5 interfacial compounds in the solder/Cu joints transformed into Cu6(Sn,In)5. |
| Databáze: | OpenAIRE |
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