Early stage of plastic deformation in thin films undergoing electromigration

Autor:	Nobumichi Tamura, Richard Celestre, J. R. Patel, W. A. Caldwell, B. W. Batterman, B. C. Valek, William D. Nix, John C. Bravman, Ralph Spolenak, A. A. MacDowell, H. A. Padmore
Rok vydání:	2003
Předmět:	Materials science Metallurgy General Physics and Astronomy Electromigration Cathode law.invention Anode Stress (mechanics) law Composite material Thin film Dislocation Current density Hillock
Zdroj:	Journal of Applied Physics. 94:3757-3761
ISSN:	1089-7550 0021-8979
DOI:	10.1063/1.1600843
Popis:	Electromigration occurs when a high current density drives atomic motion from the cathode to the anode end of a conductor, such as a metal interconnect line in an integrated circuit. While electromigration eventually causes macroscopic damage, in the form of voids and hillocks, the earliest stage of the process when the stress in individual micron-sized grains is still building up is largely unexplored. Using synchrotron-based x-ray microdiffraction during an in-situ electromigration experiment, we have discovered an early prefailure mode of plastic deformation involving preferential dislocation generation and motion and the formation of a subgrain structure within individual grains of a passivated Al (Cu) interconnect. This behavior occurs long before macroscopic damage (hillocks and voids) is observed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::95ca98e6e22c2fbb24a657fcd246d152 https://doi.org/10.1063/1.1600843 Zobrazit plný text záznamu