A superior design for high power GaN-based light-emitting diode packages
| Autor: | Snow H. Tseng, Kuan-Yung Liao |
|---|---|
| Rok vydání: | 2015 |
| Předmět: |
Materials science
business.industry Monte Carlo method Radiation Condensed Matter Physics Electronic Optical and Magnetic Materials law.invention Power (physics) Optics law Thermal Materials Chemistry Optoelectronics Junction temperature Electrical and Electronic Engineering business Intensity (heat transfer) Light-emitting diode Diode |
| Zdroj: | Solid-State Electronics. 104:96-100 |
| ISSN: | 0038-1101 |
| DOI: | 10.1016/j.sse.2014.11.008 |
| Popis: | The radiation performance of light-emitting diodes with hemispherical encapsulated lenses at the packaging level is analyzed by a Monte Carlo ray-tracing simulation. Based on optical and thermal considerations, a superior design for integrated LED packages is proposed and consistent trends are obtained in both simulated and experimental results. For integrated LED packages conforming to our design rules, a 7.1% enhancement of light output intensity is demonstrated and a 5.1 °C reduction of junction temperature given a 700 mA injection current is measured. This improvement may be of particular significance for an LED module system with higher power and/or larger arrays. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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