Development of Liquid Solder Resist Based on Polyimide

Autor:	Akira Shimada, Keiko Yamanaka, Nobuo Matsumura
Rok vydání:	2009
Předmět:	Materials science Polymers and Plastics Resist Soldering Organic Chemistry Materials Chemistry Composite material Polyimide
Zdroj:	Journal of Photopolymer Science and Technology. 22:437-439
ISSN:	1349-6336 0914-9244
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::959ed08dfddeac13a5931e2335cfe597 https://doi.org/10.2494/photopolymer.22.437 Zobrazit plný text záznamu