Silicon-on-insulator power integrated circuits

Autor: D.M. Garner, G. Ensell, A. Popescu, Kuang Sheng, William I. Milne, Florin Udrea, H.T Lim
Rok vydání: 2001
Předmět:
Zdroj: Microelectronics Journal. 32:517-526
ISSN: 0026-2692
DOI: 10.1016/s0026-2692(01)00024-6
Popis: A power integrated circuit process has been developed, based on silicon-on-insulator, which allows intelligent CMOS control circuitry to be placed alongside integrated high-voltage power devices. A breakdown voltage of 335 V has been obtained by using a silicon layer of 4 μm thickness together with a buried oxide layer of 3 μm thickness. The respective LDMOS specific on-resistance and LIGBT on-state voltage for this breakdown voltage were 148 mΩ cm2 and 3.9 V, respectively.
Databáze: OpenAIRE