| Popis: |
The VISA program has been sponsored by DARPA to enable a significant enhancement in signal conditioning, processing, and digitalization on the focal plane of visible and infrared sensors. The approach being developed builds on the traditional “hybrid” structure of a detector with a 2D array of indium-bump interconnects to a silicon readout. VISA will allow additional layers of silicon processing chips to be connected below the readout to provide more complex functionality. Connections will be fully arrayed two-dimensionally with one or more vias per pixel possible. The structural overview will be presented along with several application candidates that appear to be most promising to exploit this technology. These include active/passive sensors, expanded charge storage capacity for full flux utilization in the LWIR, cameras on a chip, high speed sub-frame collection to defeat pulsed laser interference, together with digital output with greater bit depth than currently possible from analog outputs. An A/D candidate circuit to achieve this performance within each pixel will be described. |
