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Using acoustic microscopy, we have examined polycrystalline diamond films grown by theCVD process on silicon substrates. This technique enables nondestructive characterization ofthese films with regard to their grain size, stress patterns and boundary anomalies between thefilm and the substrate.We have used a scanning acoustic microscope (SAM) to characterize several diamond filmsgrown on silicon substrates at Crystallume and at ASTEX Co. The film thicknesses ranged from1 um to 100 pm with nominal grain sizes from 0.3 to 8 pm. Results will be presented showingvarious microstructural features in the films. 1. INTRODUCTION Scanning acoustic microscopy can produce images of the elastic properties of diamond films with a resolution of the order of micrometers. Acoustic microscopy offers the capability of examining the subsurface properties of optically opaque materials, making precise measurements of surface acoustic wave velocities, and providing image contrast corresponding to changes in the elastic properties of microstructures. In layered structures, the acoustic |
