Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Autor: Nick Hoo, Dag Andersson, Aleš Kroupa, Jeremy Pearce, Andy Watson, Stuart Albert Mucklejohn, Alan Dinsdale
Rok vydání: 2012
Předmět:
Zdroj: Journal of Materials Engineering and Performance. 21:629-637
ISSN: 1544-1024
1059-9495
DOI: 10.1007/s11665-012-0125-3
Popis: The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M ≈ 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M ≈ 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications.
Databáze: OpenAIRE
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