Investigation of the Influence of Small Hole on the Fatigue Crack Growth Path
| Autor: | Xin Zhang, Xingquan Zhang, Yiwei Zhang, Shengzhi Li, Zhilai Huang, Long Li, Jian-You Feng, Shiwei Duan |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
business.industry Mechanical Engineering Fatigue testing 02 engineering and technology Structural engineering Paris' law 021001 nanoscience & nanotechnology 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials Single hole Solid mechanics Path (graph theory) General Materials Science Small hole 0210 nano-technology Safety Risk Reliability and Quality business Stress intensity factor |
| Zdroj: | Journal of Failure Analysis and Prevention. 16:391-399 |
| ISSN: | 1864-1245 1547-7029 |
| DOI: | 10.1007/s11668-016-0098-x |
| Popis: | The goal of this paper is to investigate the fatigue crack growth (FCG) path in 7075-T6 aluminum alloy affected by small hole. The codes ANSYS and FRANC3D are jointly used to compute the stress intensity factors and predict the FCG path. The predicted results show that the fatigue crack turns its growth direction toward the hole. The different locations and sizes of single hole have different influences on the FCG paths, while two symmetrically distributed holes have no effects on the FCG path. The predicted FCG paths are validated by the related FCG test results. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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