Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure
| Autor: | R. J. Krane, T. J. Phillips |
|---|---|
| Rok vydání: | 1991 |
| Předmět: |
Engineering
Natural convection Meteorology business.industry Acoustics Enclosure Rayleigh number Aspect ratio (image) Square (algebra) Computer Science Applications Electronic Optical and Magnetic Materials Heat flux Mechanics of Materials visual_art Electronic component Heat transfer visual_art.visual_art_medium Electrical and Electronic Engineering business |
| Zdroj: | Journal of Electronic Packaging. 113:301-308 |
| ISSN: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.2905410 |
| Popis: | This investigation consisted of an experimental study of the natural convection heat transfer from a square, horizontally oriented electronic component board mounted in a low-aspect-ratio enclosure with a square planform. The component board was simulated by an upward-facing constant heat flux surface. A variety of experiments were performed to determine the effects of systematically varying the enclosure geometry on the maximum surface temperature on the board for two values of the modified Rayleigh number (heater power setting). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|