Study on damage and fracture of thin-film stacked structures through indentation test with acoustic emission sensing
| Autor: | Alfred Yeo, Fa Xing Che, Yang Kai, Kun Zhou |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
business.product_category
Materials science 02 engineering and technology 01 natural sciences Displacement (vector) Indentation 0103 physical sciences General Materials Science Thin film Composite material Civil and Structural Engineering 010302 applied physics business.industry Mechanical Engineering Work (physics) Structural engineering 021001 nanoscience & nanotechnology Condensed Matter Physics body regions Cracking Acoustic emission Mechanics of Materials Fracture (geology) Die (manufacturing) 0210 nano-technology business |
| Zdroj: | International Journal of Mechanical Sciences. :159-167 |
| ISSN: | 0020-7403 |
| DOI: | 10.1016/j.ijmecsci.2017.04.026 |
| Popis: | An indentation damage test comprises a micro-mechanical tester and an acoustic emission sensor is employed to evaluate the critical force or displacement required to crack the bulk Si die specimen and thin-film stacked specimens. The associated works before and after the indentation damage test are examined from the force-displacement F-d curve. The pseudo-work of indentation damage W d describes the work done by the indenter on the damaged specimen after the crack initiation and propagation, which can be determined by multipling the onset crack force Fc with the ‘pop-in’ or plateau length l obtained from the F-d curve. A simple energy-based approach is then proposed to determine the work of indentation fracture W f based on the difference in the elastic strain recovery between a damaged and a non-damaged specimen during the unloading stage from the onset crack force Fc. It is found that the energy involved in cracking the specimen is much higher than the work done by the indenter at Fc onto those damaged specimens, i.e. Wd |
| Databáze: | OpenAIRE |
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