Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process
| Autor: | Tobias Bernhard, Tanu Sharma, Alexandre Leger, Alexandre E. Landry, Ralf Brüning, Delilah A. Brown, Frank Brüning, Sebastian Zarwell |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Hydrogen Metals and Alloys chemistry.chemical_element Blisters 02 engineering and technology Surfaces and Interfaces 021001 nanoscience & nanotechnology 01 natural sciences Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials Nickel chemistry Chemical engineering Plating 0103 physical sciences Materials Chemistry medicine Deposition (phase transition) medicine.symptom 0210 nano-technology Embrittlement Hydrogen production |
| Zdroj: | Thin Solid Films. 666:76-84 |
| ISSN: | 0040-6090 |
| Popis: | Hydrogen co-deposition in electroless copper is a cause of embrittlement, voids and blisters. Hydrogen release in the plating bath and its incorporation into the copper films were measured. The amount of hydrogen in the films was determined by monitoring its release over several days at ambient conditions. The mixed potential and the film stress were recorded during film deposition. Adding nickel ions in the plating bath lowers the mixed potential, and it reduces hydrogen incorporation from about 25 at.% to 0.01 at.%. However, the total amount of hydrogen generated per amount of plated copper remains unchanged. For films plated without nickel, the biaxial stress of the films and their hydrogen content are proportional with 3.2 ± 0.3 MPa/at. % H. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect