Void Detection in the Solder Layer between Power Semiconductor and PCB

Autor:	Nils Jahn, Martin Pfost
Rok vydání:	2022
Zdroj:	2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
DOI:	10.1109/therminic57263.2022.9950678
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::93d5c0ef9aa553df12f0581afa1ccdd8 https://doi.org/10.1109/therminic57263.2022.9950678 Zobrazit plný text záznamu