Determination of Adhesion Energy of CNxThin Film on Silicon from Micro-Scratch Testing
| Autor: | Weidian Shen, Jia-Da Wu, Peinan Wang, Jian Sun, Zhiqiang Liu |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
Materials science
Normal force Silicon Mechanical Engineering Delamination chemistry.chemical_element Surfaces and Interfaces Substrate (electronics) Surfaces Coatings and Films chemistry Mechanics of Materials Scratch Wafer Thin film Composite material Deformation (engineering) computer computer.programming_language |
| Zdroj: | Tribology Transactions. 47:130-137 |
| ISSN: | 1547-397X 1040-2004 |
| Popis: | A method for calculating the adhesion energy of CNx thin film on silicon wafer is presented. In the energy-based method, primary concerns are focused on modeling the critical load, friction coefficient, and deformation properties of the film/substrate composite during a continuous micro-scratch testing. By relying less on the geometry (i.e., the area of the debonded film) of the film delamination occurring ahead of the indenter, this method avoids an error source arising from measurements of the parameter, which has been required in published models. Experimental observations show that, for the film/substrate system, the principal failure mode when subjected to a tangential and normal force is the film delamination from its substrate once the critical normal force necessary to cause failure under the sliding indenter is reached. Based on the measured data from the continuous micro-scratch testing along with an AFM, the adhesion energy of the film/substrate system has been determined to be 60 J/m2. A reaso... |
| Databáze: | OpenAIRE |
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