| Autor: |
Eric R. Motto, Shogo Shibata, Nicholas Clark |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
2015 IEEE Energy Conversion Congress and Exposition (ECCE). |
| DOI: |
10.1109/ecce.2015.7310296 |
| Popis: |
This paper presents a new slim package and new RC-IGBT for Dual In-line Package Intelligent Power Modules developed by Mitsubishi Electric for motor control in consumer goods. The RC-IGBT (Reverse Conducting IGBT) integrates the IGBT and FWD into a single chip, which results in an incredible space savings for DIPIPM™ style devices. The SLIMDIP features built-in bootstrap diodes and current limiting resistors so that the only external component required for the high side supplies is bootstrap capacitor. The new SLIMDIP products also provide built-in temperature monitoring with analog feedback to the controller (Fig. 1). The DIPIPM Ver.5 also contains a unique super thin state-of-the-art 600V RC-IGBT CSTBT™ (Carrier Stored Trench-gate Bipolar Transistor) chip. The SLIMDIP is available with a rating of up to 15A/600V, suitable for motor drives up to 1.5kW, in a package area of 32.8mm × 18.8mm. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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