| Autor: |
Tsuyoshi Ogawa, Toshihisa Nonaka, Kazutaka Honda, Koseki Yuta |
| Rok vydání: |
2018 |
| Předmět: |
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| Zdroj: |
2018 7th Electronic System-Integration Technology Conference (ESTC). |
| DOI: |
10.1109/estc.2018.8546372 |
| Popis: |
The performance of the newly developed film to level the applied pressure among dies in the process of multi dies simultaneous bonding was evaluated. Sintering Ag paste was used as pre-applied connection material. The leveling performance was evaluated by nine dies simultaneous bonding. The height of the dies was intentionally differed one another, which was controlled by a SUS tape insertion between the bonding tool and the dies. The film compensated the height difference of up to 50 $\mu$m in the bonding process. The results of the cross sectional observation after the bonding showed that the dense sintered Ag layer was formed uniformly in all dies in spite of with and without the SUS tape insertion on the backsides of the dies. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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