Mitigation of Sn Whisker Growth by Small Bi Additions

Autor:	Kyoko Hamasaki, Shijo Nagao, Masanobu Tsujimoto, Katsuaki Suganuma, Tohru Sugahara, Jung-Lae Jo
Rok vydání:	2013
Předmět:	Equiaxed crystals Materials science Whiskers Metallurgy Intermetallic Temperature cycling Condensed Matter Physics Grain size Electronic Optical and Magnetic Materials Whisker Indentation Materials Chemistry Electrical and Electronic Engineering Composite material Electroplating
Zdroj:	Journal of Electronic Materials. 43:1-8
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-013-2706-9
Popis:	In this study, the morphological development of electroplated matte Sn and Sn-xBi (x = 0.5 wt.%, 1.0 wt.%, 2.0 wt.%) film surfaces was investigated under diverse testing conditions: 1-year room-temperature storage, high temperature and humidity (HTH), mechanical loading by indentation, and thermal cycling. These small Bi additions prevented Sn whisker formation; no whisker growth was observed on any Sn-xBi surface during either the room-temperature storage or HTH testing. In the indentation loading and thermal cycling tests, short (
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::931f94cc56ade00c6d8f94b9408440bf https://doi.org/10.1007/s11664-013-2706-9 Zobrazit plný text záznamu Full text from SpringerLink