Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates
| Autor: | Donald Francis Susan, Paul F. Hlava, Jerome A. Rejent, Paul T. Vianco |
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| Rok vydání: | 2009 |
| Předmět: | |
| Zdroj: | Journal of Materials Science. 44:545-555 |
| ISSN: | 1573-4803 0022-2461 |
| DOI: | 10.1007/s10853-008-3083-2 |
| Popis: | Long-term metallurgical aging was studied in thermal switches comprised of 52In–48Sn (at.%) alloy solder plugs contained in Cu-plated stainless steel cylinders. These switches are locking devices designed so that, if overheated, a “fusible” alloy melts and allows the activation of a spring-loaded mechanism. The soldered assemblies studied ranged in age from about 24 to 28 years old at the time of this analysis. A concern has been the buildup of intermetallic compound (IMC) within the solder or at the solder/substrate interface, which could raise the switch operating temperature. In this work, the melting temperature of the aged solder alloy was slightly lower (116.3 ± 0.3 °C) than the expected value, 118.4 °C (245 °F), based on differential scanning calorimetry (DSC). The slight decrease in melting temperature range was caused by the diffusion of a small amount of Cu into the solder during processing and possibly during long-term service. The interfacial IMC layer was primarily Cu2In3Sn. The IMC thickness agreed with that predicted by growth kinetics determined in a previous study, assuming aging temperatures in the vicinity of room temperature. Differences in the IMC phase chemistries were found between earlier research, which employed bulk Cu substrates, and the present analyses with thin electroplated Cu substrates. Evidence was found for depletion of the thin Cu plating layer over time, as well as incorporation of Fe and Ni from the stainless steel into the IMC layer. |
| Databáze: | OpenAIRE |
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