Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies
Autor: | Ashwin Chockalingam, Jason G. Fung, Rajeev Bajaj, Gana Ganapathi, Fred C. Redeker, Zhibo Yuan, Puneet Jawali, Raghava Kakireddy, Daniel Redfield, Aniruddh Khanna, Boyi Fu, Patibandla Nag B, Chris Orilall, Mario Cornejo, Mayu Yamamura |
---|---|
Rok vydání: | 2019 |
Předmět: | |
Zdroj: | ECS Journal of Solid State Science and Technology. 8:P3063-P3068 |
ISSN: | 2162-8777 2162-8769 |
Databáze: | OpenAIRE |
Externí odkaz: |