Affordable and Comprehensive Testing of 3-D Stacked Die Devices

Autor:	Jean-Francois Cote, Jeff Fan, Sean Shen, Givargis Danialy, Marcin Lipinski, Michael Garbers, Wu Yang, Martin Keim, Andreas Glowatz, Joe Reynick, Ayush Patel, Joanna Michna
Rok vydání:	2022
Předmět:	Hardware and Architecture Electrical and Electronic Engineering Software
Zdroj:	IEEE Design & Test. 39:17-25
ISSN:	2168-2364 2168-2356
DOI:	10.1109/mdat.2022.3191016
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::924eaecfa188df5e64e009266b16d818 https://doi.org/10.1109/mdat.2022.3191016 Zobrazit plný text záznamu