A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

Autor:	S. W. Ricky Lee, H. L. Henry Wu
Rok vydání:	2011
Předmět:	Materials science chemistry Linear sweep voltammetry Inorganic chemistry Copper plating Exchange current density chemistry.chemical_element Electrolyte Chronoamperometry Electroplating Electrochemistry Copper
Zdroj:	2011 International Symposium on Advanced Packaging Materials (APM).
Popis:	In this study, authors studied and compared the behaviors of the additives in copper sulfate and cupric methanesulfonate electrolytes by means of electrochemical measurement method with a rotary electrode. The electrochemical parameters including exchange current density and cathodic transfer coefficient of the electrolytes were successfully determined utilizing linear sweep voltammetry. Chronoamperometry (CA) was conducted to verify the diffusion time of additives to the surface of electrodes and the corresponding diffusion constants were characterized. Copper plating of 50/200 μm TSVs was achieved with copper sulfate and cupric methanesulfonate electrolytes respectively. The plated surface morphologies were studied using Scanning Electron Microscopy (SEM).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::92342e713bad68ff047132054786431d https://doi.org/10.1109/isapm.2011.6105719 Zobrazit plný text záznamu