Impact strength of Sn58Bi and Sn45Bi2.6Zn0.5In solder joints after isothermal aging
Autor: | Zhi Jin, Shunsuke Fujiwara, Junichi Takenaka, Koichi Hagio, Hiroshi Nishikawa |
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Rok vydání: | 2023 |
Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
DOI: | 10.23919/icep58572.2023.10129730 |
Databáze: | OpenAIRE |
Externí odkaz: |
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