Impact strength of Sn58Bi and Sn45Bi2.6Zn0.5In solder joints after isothermal aging

Autor: Zhi Jin, Shunsuke Fujiwara, Junichi Takenaka, Koichi Hagio, Hiroshi Nishikawa
Rok vydání: 2023
Zdroj: 2023 International Conference on Electronics Packaging (ICEP).
DOI: 10.23919/icep58572.2023.10129730
Databáze: OpenAIRE
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