Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist
| Autor: | Kim Peng Lim, Cher Ming Tan, Tai Chong Chai, Guat Cheng Lim |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
Engineering
business.industry Open-circuit voltage Capacitive sensing Hardware_PERFORMANCEANDRELIABILITY Substrate (printing) Condensed Matter Physics Line width Atomic and Molecular Physics and Optics Fault detection and isolation Surfaces Coatings and Films Electronic Optical and Magnetic Materials Resist Soldering Non destructive Hardware_INTEGRATEDCIRCUITS Electronic engineering Optoelectronics Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | Microelectronics Reliability. 45:1572-1575 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2005.07.049 |
| Popis: | As the printed wiring density on organic substrate is increasing, the line width and spacing are reducing toward 25 μm and below. Present method of fault isolation will no longer be adequate, and capacitive voltage contrast method is proposed. The feasibility of the voltage contrast method is demonstrated, and the various key parameters for better contrast are identified and determined. Circuit model is developed to explain the experimental results and the significance of the various key parameters. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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