Loss Performance of Planar Interconnects on FR-4 Up to 67 GHz
| Autor: | Rashaunda Henderson, Supreetha Rao Aroor |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
Permittivity
Materials science business.industry Coplanar waveguide Attenuation Industrial and Manufacturing Engineering Microstrip Electronic Optical and Magnetic Materials FR-4 Planar Extremely high frequency Electronic engineering Optoelectronics Electrical and Electronic Engineering Antenna (radio) business |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 3:2127-2133 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2013.2264475 |
| Popis: | This paper shows the performance of planar transmission lines (TLs) on a multilayer stack-up with a flame resistant-4 (FR-4)-based core up to 67 GHz. These lines will be used as interconnects to integrate a CMOS circuit with an antenna fabricated on FR-4 for a low-cost system-in-package solution. The attenuation characteristics of coplanar waveguide (CPW), grounded coplanar waveguide (GCPW), and microstrip lines with different configurations are investigated. The peak attenuation varies from 0.15 to 0.45 dB/mm at 60 GHz, depending on the line type and geometry. In addition, the effective permittivity and loss tangent of the multilayer stack-up are determined using CPW TLs. The overall results show that FR-4-based materials are viable candidates for packaging at the millimeter-wave frequency range if suitable line lengths are utilized. |
| Databáze: | OpenAIRE |
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