Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode
| Autor: | K. T. Lee, Yu-Chuan Lin, Tung-Han Chuang, Cheng-Ting Hsu, Sheng-Chi Chen, J. D. Hwang, Hsu-Shen Chu |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Materials science Metallurgy Intermetallic 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Thermoelectric materials 01 natural sciences Electronic Optical and Magnetic Materials Barrier layer Thermoelectric generator Phase (matter) 0103 physical sciences Thermoelectric effect Materials Chemistry Melting point Electrical and Electronic Engineering Composite material 0210 nano-technology Layer (electronics) |
| Zdroj: | Journal of Electronic Materials. 45:4935-4942 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-016-4645-8 |
| Popis: | The ZnSb intermetallic compound may have thermoelectric applications because it is low in cost and environmentally friendly. In this study, a Zn4Sb3 thermoelectric element coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode using a Ag/Sn/Ag solid–liquid interdiffusion bonding process. The results indicated that a Ni5Zn21 intermetallic phase formed easily at the Zn4Sb3/Ni interface, leading to sound adhesion. In addition, Sn film was found to react completely with the Ag layer to form a Ag3Sn intermetallic layer having a melting point of 480°C. The resulting Zn4Sb3 thermoelectric module can be applied at the optimized operation temperature (400°C) of Zn4Sb3 material as a thermoelectric element. The bonding strengths ranged from 14.9 MPa to 25.0 MPa, and shear tests revealed that the Zn4Sb3/Cu-joints fractured through the interior of the thermoelectric elements. |
| Databáze: | OpenAIRE |
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