| Popis: |
The objective of this program was to develop and evaluate low molecular weight silicone and halocarbon polymers which are solvent removable for application to hybrid microcircuits for contaminant protection. Three experimental silicone waxes and four halocarbon waxes were selected for evaluation. The materials were chemically, thermally and electrically characterized. The stressing effects of these coatings on one-mil gold wire bonded to aluminized silicon die were determined by thermal cycling from minus 65 C to plus 150 C. Half of the wire bond samples were subsequently tested for moisture resistance per MIL-STD-883A, Method 1004.1, without bias. |
