RF passive components in MCM-D
| Autor: | R. A. Flacker, S.D. Yamamoto, E. A. Gomes, C. M. Cabreira, Jacobus W. Swart, L. B. Zoccal, José Alexandre Diniz |
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| Rok vydání: | 2007 |
| Předmět: |
Materials science
business.industry Multi-chip module Electrical engineering Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Inductor Focused ion beam law.invention Capacitor Hardware_GENERAL law visual_art Electronic component Hardware_INTEGRATEDCIRCUITS visual_art.visual_art_medium Optoelectronics Thin film business Electronic circuit |
| Zdroj: | 2007 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference. |
| DOI: | 10.1109/imoc.2007.4404227 |
| Popis: | Thin film multilayer multi chip module technology (MCM-D) may be used to realize high quality RF (radio-frequency) passive components (capacitors and inductors) and circuits patterns (transmission lines). MCM-D structure is built with metallic and dielectric layers deposited on alumina substrate by employing adapted techniques used for semiconductor integrated circuit (IC) manufacturing. These RF passive components and circuits in MCM-D were manufactured and simulated electromagnetically according to their geometry and material electrical characteristics using method of moments (MoM). Focused Ion Beam (FIB) was used for MCM-D structure analysis and layer thickness measurements. Up to 10 GHz on-wafer measurements were carried out on manufactured structures and shown good agreement with simulation results indicating they are applicable on RF devices and modules for many wireless applications. |
| Databáze: | OpenAIRE |
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