Removal of Organic Wax and Particles on Final Polished Wafer by Ozonated DI Water

Autor:	Gun-Ho Lee, Jae-Hwan Yi, Eun-Suck Choi, Seung-Ho Lee, Jin-Goo Park, Tae-Gon Kim
Rok vydání:	2008
Předmět:	Wax Materials science Semiconductor device fabrication visual_art Metallurgy visual_art.visual_art_medium Forensic engineering General Materials Science Wafer Process time Wax removal
Zdroj:	Korean Journal of Materials Research. 18:307~312-307~312
ISSN:	2287-7258 1225-0562
DOI:	10.3740/mrsk.2008.18.6.307
Popis:	As increasing the sizeof wafers for the mass production of device, theimproved uniformity and near zero defects of Si wafersare required for the semiconductor manufacturing. Ingeneral, vacuum chuck or membrane type films are usedto attach the wafers on a polisher head for polishingprocess. However, organic wax has been also used toattach the wafer on the head for the final batch typepolishing process particularly in order to achieve the highuniformity of wafers as shown in Fig. 1. After thepolishing process, organic wax and its residue should beremoved from wafer back sides. A commercial andproprietary dewaxer was used to remove a thick organicwax but, several steps of SC-1 cleanings were followedfor the removal of residues and particles as shown in Fig2 (a) in a conventional wafer backside cleaning process.It requires a long process time, high temperature, muchchemical and DI water waste which cause the high costof ownership (CoO).
Databáze:	OpenAIRE
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