The Formation Of Electroplating Molds By Reactive Ion Etching

Autor:	Michael W. Putty, Shih-Chia Chang, David Byrum Hicks
Rok vydání:	2005
Předmět:	chemistry.chemical_classification Materials science Resist chemistry Etching (microfabrication) Plating Metallurgy Polymer Composite material Reactive-ion etching Electroplating Polyimide Power density
Zdroj:	Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
DOI:	10.1109/sensor.1995.717290
Popis:	Polyimide, polymethylmethacrylate (PMMA) and polyester-based polymers were investigated as potential electroplating mold materials. They showed high tensile stress (/spl equiv/10/sup 8/ dyne/cm/sup 2/) after heat treatment at temperatures /spl ges/ 200/spl deg/C. Conventional reactive ion etching techniques together with a trilevel masking scheme was used to delineate the polymer layers. The etch mask used was either spin-on glass or aluminum, and the etch gas was oxygen. With proper power density and etch gas pressure, aspect ratios >5 were obtained. Compatibility issues between RIE and the etch mask materials, as well as between RIE and the plating base materials are discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8fcfe829f68a1c58220c47d3accc057d https://doi.org/10.1109/sensor.1995.717290 Zobrazit plný text záznamu