Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process

Autor:	Yen-Jui Cheng, Cheng-Hsin Lu, Fan-Yi Ouyang
Rok vydání:	2021
Předmět:	Materials science Solid-state physics Intermetallic Electronic packaging Activation energy Condensed Matter Physics Isothermal process Electronic Optical and Magnetic Materials Chemical engineering Elemental analysis Soldering Materials Chemistry Growth rate Electrical and Electronic Engineering
Zdroj:	Journal of Electronic Materials. 50:6575-6583
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-021-09253-4
Popis:	In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow process significantly affect the mechanical properties of the devices. In this study, In solder and Ni under-bump metallization (UBM) were chosen to investigate the solid–liquid interfacial reaction under an isothermal reflow process. Two types of IMCs, uniform and scallop-type, were formed in turn after being reflowed at three different temperatures, 220°C, 250°C, and 280°C. Elemental analysis has revealed that the compositions of both types of IMCs are nearly the same and were eventually identified as Ni3In7. By the growth rate of IMC formation, the mechanism of the growing process was proposed to be a diffusion-controlled process. The activation energy (Q) of the IMC formation was calculated to be 83.8 $$\frac{{ {\text{kJ}}}}{{{\text{mol}}}}$$ .
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8f998b0f74ca5f36d7e17ecb051e4899 https://doi.org/10.1007/s11664-021-09253-4 Zobrazit plný text záznamu Full text from SpringerLink