Ultralow dielectric cross-linked silica aerogel nanocomposite films for interconnect technology

Autor:	Haryeong Choi, Taehee Kim, Taeho Kim, Sunil Moon, SangHyuk Yoo, Vinayak G. Parale, Rushikesh P. Dhavale, Keonwook Kang, Hyunchul Sohn, Hyung-Ho Park
Rok vydání:	2022
Předmět:	General Materials Science
Zdroj:	Applied Materials Today. 28:101536
ISSN:	2352-9407
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8f8b8fa2b75a390df9adf1ce75821bbb https://doi.org/10.1016/j.apmt.2022.101536 Zobrazit plný text záznamu Full Text from ScienceDirect