B28 Development of Grinding Machine for 450mm Wafer : Fundamental Performance of Wheel Spindle which creates both rotary and axial feed motion

Autor:	Akinori Yui, Takayuki Kitajima, Shintaro Iwahashi, Alexander H. Slocum, Ayumu Honda, Hirotsugu Saito, Jumpei Kusuyama
Rok vydání:	2014
Předmět:	Engineering business.industry Wafer Development (differential geometry) business Motion (physics) Automotive engineering Grinding
Zdroj:	The Proceedings of The Manufacturing & Machine Tool Conference. :109-110
ISSN:	2424-3094
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8f60223edf6573bb42c2a4e283bcbb6a https://doi.org/10.1299/jsmemmt.2014.10.109 Zobrazit plný text záznamu