Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power
| Autor: | Yuan-Nan Tsai, Shih-Chieh Chin, Hsin-Yo Chen, Ta-I. Yang, Mei-Hui Tsai, I.-Hsiang Tseng |
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| Rok vydání: | 2023 |
| Předmět: | |
| Zdroj: | RSC Advances. 13:13880-13885 |
| ISSN: | 2046-2069 |
| Popis: | In order to shield the electronic circuits on a transparent polyimide (PI) substrate, an anti-reflection (AR) layer was deposited on a PI film via DC reactive magnetron sputtering. |
| Databáze: | OpenAIRE |
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