Plasma Surface Modification of Polymer Backsheets: Origins of Future Interfacial Barrier/Backsheet Failure
| Autor: | S. H. Glick, J. W. Pankow |
|---|---|
| Rok vydání: | 2006 |
| Předmět: |
chemistry.chemical_classification
Silicon oxynitride Materials science Ethylene-vinyl acetate Polymer Chemical vapor deposition chemistry.chemical_compound chemistry X-ray photoelectron spectroscopy Plasma-enhanced chemical vapor deposition Polyethylene terephthalate Organic chemistry Thin film Composite material |
| Zdroj: | 2006 IEEE 4th World Conference on Photovoltaic Energy Conference. |
| DOI: | 10.1109/wcpec.2006.279620 |
| Popis: | Flexible polymer substrates coated with inorganic oxide moisture barriers are a potential replacement for glass backsheets in thin-film PV (photovoltaic) modules. Silicon oxynitride (SiOxNy ) deposited by plasma enhanced chemical vapor deposition (PECVD) on polyethylene terephthalate (PET) represents one potential new backsheet candidate. Barrier deposition runs at NREL have included a nitrogen-rich plasma pretreatment prior to barrier deposition with the intention of cleaning the PET surface and enhancing adhesion of the SiO xNy barrier film to PET; however, test coupons of PET/barrier/EVA/TPE failed after damp-heat exposure. (EVA is ethylene vinyl acetate and TPE is Tedlar-PET-EVA). PET substrates exposed to plasma conditions similar to those used in pretreatment were examined by X-ray photoelectron spectroscopy (XPS) to reveal that new low molecular weight PET fragments were created at the PET surface. These fragments are responsible for barrier/PET interfacial failure and barrier transfer to the EVA encapsulant side following damp heat exposure |
| Databáze: | OpenAIRE |
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