Recent progress in low temperature curable photosensitive dielectrics
| Autor: | Tetsuya Enomoto, Nakamura Tadamitsu, Nobuyuki Saito, Daisaku Matsukawa, Masayuki Ohe, Takeharu Motobe, Abe Satoshi, Noriyuki Yamazaki |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
business.industry Nanotechnology Heat resistance 02 engineering and technology Dielectric 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences Reliability (semiconductor) Semiconductor Microsystem Wafer Adhesive 0210 nano-technology business Wafer-level packaging |
| Zdroj: | 2017 International Conference on Electronics Packaging (ICEP). |
| DOI: | 10.23919/icep.2017.7939431 |
| Popis: | Hitachi Chemical DuPont MicroSystems (HDMS) has been developing photosensitive negative-tone polyimides (PI) and positive-tone poly(benzoxazole)s (PBO) for use as protection layers in semiconductor ICs or as dielectrics for re-distribution layers in wafer level packaging. These materials offer an easy manufacturing process as well as ensuring high reliability in semiconductor packages such as fan-out wafer level packaging (FOWLP). Currently, dielectrics for FOWLP applications are cured at around 230°C. However, even lower cure temperatures are now required due to the limitations in heat resistance of packaging materials, a reduction in warpage of re-constituted wafers as well as yield improvement with embedded memory ICs. To meet these challenges, HDMS has been focusing on the development of a low temperature curable PI and PBO that can also achieve high resolution and excellent cured film properties. In this paper, recent progress in our latest PI and PBO materials will be introduced. |
| Databáze: | OpenAIRE |
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