A Holistic Development Framework for Hybrid Bonding
Autor: | Srikrishna Sitaraman, Liu Jiang, Sefa Dag, Mohammad Masoomi, Ying Wang, Prayudi Lianto, Jinho An, Ruiping Wang, Gilbert See, Arvind Sundarrajan, El Mehdi Bazizi, Buvna Ayyagari-Sangamalli |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). |
Databáze: | OpenAIRE |
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