Power module packaging technologies for silicon and silicon carbide in automotive applications – challenges and solutions

Autor:	T. Grasshoff, P. Beckedahl
Rok vydání:	2018
Předmět:	chemistry.chemical_compound Materials science chemistry Silicon business.industry Power module Silicon carbide Automotive industry chemistry.chemical_element business Engineering physics
Zdroj:	Dritev – Drivetrain For Vehicles 2018
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8ee8d81a804ec75f7a369316027248a6 https://doi.org/10.51202/9783181023280-ii-19 Zobrazit plný text záznamu