Crackless glass through-structure fabrication with laser-induced backside wet etching using detachably bonded cover

Autor:	Kui-Kam Kwon, Dae-Seob Song, Ying-Jun Quan, Ji Ho Jeon, Sung-Hoon Ahn
Rok vydání:	2022
Předmět:	Mechanical Engineering Industrial and Manufacturing Engineering
Zdroj:	CIRP Annals. 71:161-164
ISSN:	0007-8506
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8ee7129e9633d9d5821964e4ab264fa8 https://doi.org/10.1016/j.cirp.2022.04.025 Zobrazit plný text záznamu Full Text from ScienceDirect