Lateral Scanning Linnik Interferometry for Large Field of View and Fast Scanning: Wafer Bump Inspection

Autor:	Soon-Geul Lee, Min Y. Kim, Kalyana C. Veluvolu
Rok vydání:	2011
Předmět:	Materials science business.industry Mechanical Engineering Coplanarity Linnik interferometer Interferometry Optics Reliability (semiconductor) Soldering Miniaturization Wafer Integrated circuit packaging Electrical and Electronic Engineering business Instrumentation
Zdroj:	International Journal of Optomechatronics. 5:271-285
ISSN:	1559-9620 1559-9612
Popis:	Wafer-level packaging is currently the major trend in semiconductor packaging for miniaturization and high-density integration. To ensure the package reliability, the wafer and substrate bumps utilized as connection junctions need to be in-line inspected as regards their top-height distribution, coplanarity, and volume uniformity. This article proposes a lateral scanning interferometric system for wafer bump shape inspection in three dimensions with a large field of view and fast inspection speed based on an optomechatronic system design. For multiple-peak interferogram from wafer bumps around a transparent film layer, two-step information extraction algorithms are suggested, including top surface profile and under-layer surface profile detection algorithms. The multiple-peak interferogram is acquired with variations of lateral position of the reference mirror by a piezoelectric transducer (PZT). A series of experiments is performed for representative wafer samples with solder and gold bumps, and the effe...
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8ee461fa20f60156100067e1e45ced76 https://doi.org/10.1080/15599612.2011.604116 Zobrazit plný text záznamu Plný text ve formátu PDF Plný text ve formátu HTML
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