Pulsed Laser Assisted Chemical Etch for analytic surface preparation

Autor:	Robert Chivas, Scott Silverman, Niru Dandekar
Rok vydání:	2012
Předmět:	Chemical process Materials science Silicon business.industry Analytical chemistry chemistry.chemical_element Laser Focused ion beam Isotropic etching law.invention chemistry law Etching (microfabrication) Surface roughness Optoelectronics Pyrolytic carbon business
Zdroj:	2012 IEEE International Reliability Physics Symposium (IRPS).
DOI:	10.1109/irps.2012.6241787
Popis:	Pulsed Laser Assisted Chemical Etching (PLACE) is an advanced method of surface preparation for analytic investigations such as: Focused Ion Beam (FIB) circuit edit, Failure Analysis chemical processes (poly-Si etch), Backside SIMS and Optical techniques such as Photoemission Microscopy. PLACE can achieve ultra-high purity and fine dimensional control since it is a dry process relying on pyrolytic vapor phase reactions initiated, and constrained, by a pulsed laser.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8ea5b5a5d2d8c1a14bdace295eaf982f https://doi.org/10.1109/irps.2012.6241787 Zobrazit plný text záznamu