Electroless Copper Deposition Using Sn/Ag Catalyst on Epoxy Laminates
| Autor: | Zachary Wilson, Erdal Uzunlar, Paul A. Kohl |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
Materials science
Renewable Energy Sustainability and the Environment Metallurgy chemistry.chemical_element Sulfuric acid Epoxy Condensed Matter Physics Electrochemistry Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials Catalysis chemistry.chemical_compound Adsorption chemistry Chemical engineering X-ray photoelectron spectroscopy visual_art Materials Chemistry visual_art.visual_art_medium Surface roughness |
| Zdroj: | Journal of The Electrochemical Society. 160:D3237-D3246 |
| ISSN: | 1945-7111 0013-4651 |
| DOI: | 10.1149/2.039312jes |
| Popis: | Electroless copper deposition was investigated on epoxy laminate substrates (Isola 185HR) using a silver-based catalyst, and a nonroughening surface treatment method based on sulfuric acid. The current challenges in electroless copper deposition include (i) high cost of Pd-based catalysts, (ii) deterioration of electrical performance of deposited metal at high frequency due to electron scattering at the roughened surface, and (iii) limited adhesion strength of electroless layers to substrates. We investigated an electroless copper deposition procedure composed of a H2SO4 surface pretreatment, two-step Sn/Ag nano-colloidal catalyst seeding, and immersion in a traditional formaldehyde-containing electroless copper bath. The H2SO4 pretreatment activated the epoxy surface for electroless deposition. Other strong acids did not lead to deposition. The H2SO4 treatment cleaned the substrate and provided the adhesion of the catalyst and electroless copper without increasing the surface roughness. XPS results showed a decrease in the carbonyl groups (C=O), and acid/ester functionalities (O-C=O) at the surface. Adsorbed sulfate on the substrate from the H2SO4 treatment led to Sn(II) sensitization. The tin-silver activation step resulted in Sn(IV) and Ag(0) products in the form of a Sn/Ag nano-colloidal catalyst. The Sn/Ag colloid acted as a catalyst for electroless copper deposition on the epoxy laminate substrates. © 2013 The Electrochemical Society. [DOI: 10.1149/2.039312jes] All rights reserved. |
| Databáze: | OpenAIRE |
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