Temporary Bonding and De-bonding Process for 2.5D/3D Applications
| Autor: | Siang Kiat Neo, King-Jien Chui, Woon Leng Loh, Qin Ren |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Through-silicon via Silicon Computer science Delamination Electronic packaging Process (computing) Mechanical engineering chemistry.chemical_element 02 engineering and technology Semiconductor device 021001 nanoscience & nanotechnology 01 natural sciences De bonding chemistry 0103 physical sciences Key (cryptography) 0210 nano-technology |
| Zdroj: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC). |
| Popis: | Temporary bonding and de-bonding (TBDB) is one key technology in enabling the 2.5D/3D integration of semiconductor devices [1]. In this paper, we first evaluate two TBDB methods using different TBDB mechanism and corresponding adhesive materials, in particular for via-last Through Silicon Via (TSV) process. We compare a solvent-based TBDB method [2], [3] with another mechanical-based TBDB method. The second part of this paper analyze the process issues and root causes related to each TBDB methodology. Continuous improvement will need to rely on TBDB material and process development as well as integration optimization. |
| Databáze: | OpenAIRE |
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