Micro‐Particle Induced X‐ray Emission Study of Lead‐Free and Lead‐Based Solders and Interactions with Copper Wires

Autor:	Harry J. Whitlow, Gyula Nagy
Rok vydání:	2023
Předmět:	Materials Chemistry Surfaces and Interfaces Electrical and Electronic Engineering Condensed Matter Physics Surfaces Coatings and Films Electronic Optical and Magnetic Materials
Zdroj:	physica status solidi (a). 220
ISSN:	1862-6319 1862-6300
DOI:	10.1002/pssa.202200432
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8d6567e27c9a86a04400e205e1d55ae4 https://doi.org/10.1002/pssa.202200432 Zobrazit plný text záznamu Plný text