Tin whisker mitigation by means of a post-electroplating electrochemical oxidation treatment
Autor: | Liang Wu, Geoffrey Wilcox, Roger J. Mortimer, Mark Ashworth, Dan Haspel |
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Rok vydání: | 2015 |
Předmět: |
010302 applied physics
Materials science Metallurgy Metals and Alloys Oxide chemistry.chemical_element 02 engineering and technology Surfaces and Interfaces 021001 nanoscience & nanotechnology Condensed Matter Physics Electrochemistry Microstructure 01 natural sciences Focused ion beam Surfaces Coatings and Films chemistry.chemical_compound chemistry X-ray photoelectron spectroscopy Chemical engineering Mechanics of Materials Whisker 0103 physical sciences 0210 nano-technology Tin Electroplating |
Zdroj: | Transactions of the IMF. 93:332-341 |
ISSN: | 1745-9192 0020-2967 |
Popis: | There are very few studies that have investigated directly the effect of an oxide film on tin whisker growth, since the ‘cracked oxide theory’ was proposed by Tu in 1994 [K.-N. Tu: Phys. Rev., 1994, 49, (3), 2030–2034]. The current study has investigated the effect of an electrochemically produced oxide on tin whisker growth, for both Sn–Cu electrodeposits on Cu and pure Sn electrodeposits on brass. X-ray photoelectron spectroscopy (XPS) has been used to investigate the effect of the applied electrochemical oxidation potential on the oxide film thickness. Focused ion beam has been used to prepare cross sections from electrodeposited samples to investigate the influence of the electrochemically formed oxide film on deposit microstructure during long-term room temperature storage. The XPS studies show that the thickness of electrochemically formed oxide film is directly influenced by the applied potential and the total charge passed. Whisker growth studies show that the electrochemical oxidation treatment m... |
Databáze: | OpenAIRE |
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