Failure Analysis for Package of Gold Wire Bonding from Practical Case
Autor: | Ander Hsieh, Mike Huang, Johnny Ch Chen, Michael Yeh |
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Rok vydání: | 2022 |
Zdroj: | 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
Databáze: | OpenAIRE |
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