Failure Analysis for Package of Gold Wire Bonding from Practical Case

Autor:	Ander Hsieh, Mike Huang, Johnny Ch Chen, Michael Yeh
Rok vydání:	2022
Zdroj:	2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8d2e0fac8721615eb3fef3e99fe01fa7 https://doi.org/10.1109/impact56280.2022.9966671 Zobrazit plný text záznamu