Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Autor:	Yaqian Sun, Ming Li, Huiqin Ling, Xundi Zhang, Chenlin Yang, Anmin Hu, Jing Wang, Tao Hang, Yunwen Wu
Rok vydání:	2021
Předmět:	Morphology (linguistics) Materials science Nanotechnology Electronic Optical and Magnetic Materials
Zdroj:	Electronic Materials Letters. 17:459-470
ISSN:	2093-6788 1738-8090
DOI:	10.1007/s13391-021-00302-y
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::8cfc9f5d36c14def7bf1b2c397049133 https://doi.org/10.1007/s13391-021-00302-y Zobrazit plný text záznamu Full text from SpringerLink