Effects of RF Power Source and PR Pattern Size on Sidewall Surface of Deep Silicon Via during DRIE Process
| Autor: | Dong-Pyo Kim, Kyung-Seob Kim, Jung-Chae Jeong |
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| Rok vydání: | 2022 |
| Předmět: | |
| Zdroj: | The transactions of The Korean Institute of Electrical Engineers. 71:121-126 |
| ISSN: | 2287-4364 1975-8359 |
| DOI: | 10.5370/kiee.2022.71.1.121 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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